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Ultra-Small Package CSP/BGA Technology: A Surface Mount Pocket Book

Ultra-Small Package CSP/BGA Technology: A Surface Mount Pocket Book

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Regular price $68.99 USD
Regular price Sale price $68.99 USD
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Ultra-Small Package CSP/BGA Technology: A Surface Mount Pocket Book

This technical handbook delves into the cutting-edge field of ultra-small package technology, specifically focusing on CSP (Chip Scale Package) and BGA (Ball Grid Array) techniques. Published by Nikkan Kogyo Shimbun, a leading industrial publisher, it serves as a practical 'pocket book' guide for professionals and students alike in microelectronics, semiconductor manufacturing, and electronics engineering. Readers will find detailed insights into the principles, applications, and practical implementation of these essential surface mount technologies. Note: The text is entirely in Japanese. Brand New Japanese Edition.

ISBN 9784526041815 · ISBN-10 4526041815

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Authentic, sourced in Japan

Every item is genuine and sourced in Japan. Items are new unless the title says used. For books, we show the ISBN so you can confirm the exact edition.

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